WEBINAR | ECAD: Addressing Thermal Design Challenges with In-Design Analysis

This Cadence webinar will explore PCB designers’ key challenges and how the Cadence Allegro/Celsius workflow can streamline the design process. This integrated workflow empowers designers to deliver optimized designs throughout the development cycle, enabling thermal engineers to focus on solving thermal challenges rather than performing repetitive, time-consuming simulations.

Traditionally, PCB thermal analysis involves transferring a completed design to a standalone thermal analysis tool. While this approach has supported many successful thermal signoffs, it introduces inefficiencies. These can be eliminated with the Cadence Allegro X Design Platform for PCBs and the Celsius Studio Platform, which provide an integrated AI-driven thermal analysis flow for package and PCB design.

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Webinar takeaways:

• Accurate thermal analysis is critical before finalizing a PCB design. Early-stage thermal validation requires continuous data exchange between design, thermal, and signal/power integrity (SI/PI) teams. Any delay in this process can disrupt the design cycle and impact timelines.
• Most thermal analysis tools rely on a complex, time-intensive process to convert a PCB design into a thermal model. This requires significant manual effort, especially when analyzing multiple designs, increasing the time investment.
• Cadence’s first-to-market in-design thermal analysis (IDA) workflow, embedded within the PCB design platform, offers engineers a powerful solution. It allows them to run real-time thermal analyses during floor planning and design iterations without waiting for external feedback, resulting in faster, more efficient design cycles and higher-quality designs.

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*** The webinar is in English.