Thermal analysis shows how your design reacts to temperature changes

Heat and temperature changes are major challenges in electronics design—especially as devices become smaller, faster, and more complex. As an electronics engineer, it’s crucial for your design’s performance to understand how it reacts to temperature variations

Request a thermal analysis of your design *

* The offer is completely non-binding and free, covering one specific design from your company. Accepting the offer does not commit you to purchasing Nordcad’s solutions.

Do you recognize these problems?

Ensuring efficient heat dissipation in your design is challenging.

Managing heat in small, densely packed designs with limited cooling options is difficult.

Controlling temperature fluctuations in your design to avoid mechanical failures and breakdowns is tough.

Balancing heat dissipation and energy efficiency in your design is tricky.

Ensuring adequate cooling in enclosed systems or those with restricted airflow is a challenge.

Minimizing the number of late and costly design iterations is a struggle.

The solution to your challenges

Step #1

Analysis/simulation at the schematic level

Before looking at the PCB, it’s a good idea to simulate your schematic/diagram with a smoke analysis using a tool like PSpice.

A smoke analysis tests that all components in your circuit function correctly and safely during operation. This analysis examines how your components react to temperature, current, power, and voltage changes.

Step #2

Analysis/simulation at the PCB level

Once the schematic is finalized, the next step is to analyze the PCB using Finite Element Analysis, Computational Fluid Dynamics analysis, or both — depending on the need.

FEA analysis (using Celsius PowerDC) is a 2D/3D simulation where an object is divided into thousands of small elements, and mathematical equations simulate the performance of the entire object under heat, load, and motion effects.
CFD analysis (using Celsius EC Solver) examines how liquids and gases behave and impact components. This method allows precise fluid dynamics and heat transfer modeling in your design.

Tools for Thermal Analysis

Celsius PowerDC

Analysis/simulation focusing on solid materials (solids) using 2D/3D FEA analysis. Heat dissipation into the air is simplified.

The tool is used at the PCB level.

Learn more about Celsius PowerDC

Celsius EC Solver

Analysis/simulation focusing on airflow using 3D CFD analysis. Here, the simulation of solid materials is simplified.

The tool is used at the PCB level.

Learn more about Celsius EC Solver

PSpice

Simulation at the schematic level to prevent costly errors and ensure the quality of the final product.

The tool is used at the schematic level.

Learn more about PSpice

Free and Non-Binding

Get a thermal analysis of your design

Discover how heat affects the efficiency, reliability, and safety of your final electronic product. The analysis is based on one specific design from your company and provides insights on optimizing heat dissipation and cooling.